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NanoScan family scanning nano-hardness testers

Scanning nano-hardness testers of NanoScan series are intended for investigation of the surface topography, elastic modulus mapping and for measuring the mechanical properties (including hardness and elastic modulus) of bulk materials and thin films on a submicron and nanometer scale.

Principle

NanoScan technology is based on principles of scanning probe microscopy (SPM). The main characteristic feature of NanoScan is the use of piezoceramic probe sensor with high bending stiffness of the cantilever (~2 Х 104 N/m).

The use of the regime of resonance oscillations allows to perform the tracking of contact between the probe tip and the surface on two parameters: change of amplitude and frequency of the cantilever oscillations. This makes it possible to separate the viscous and elastic components of the tip-surface interaction, and distinguish an elastic surface and a viscous contamination layer on it, as well as to measure the mechanical properties of the surface.

High bending stiffness of the cantilever permits to go through the viscous layer until the contact with rigid surface and to make a modification of surface (indentation and scratching). The probe design allows to use diamond indentors of different type. The listed functional capabilities give a great distinction between NanoScan and other nanoindenters and SPMs.

Areas of application

The unique features of NanoScan allows to use the devices in applications where investigations can be carried out with traditional nanoindenters and SPMs and also in the areas inaccessible for such equipment.
Scanning nano-hardness testers of NanoScan series are used for surface mechanical properties investigations and quality control in the following applications:

  • Nanophase and composite materials;
  • Superdispersed hard alloys;
  • New superhard materials;
  • Nanoconstructional materials;

  • Semiconductor technology;
  • Automotive industry;
  • Engineering applications;
  • Medical applications

  • Diamond and diamond powders;
  • Memory storage devices;
  • Optical components;
  • Micro- and nano- electromechanical systems (MEMS and NEMS);

  • Thin films;
  • Friction reducing coatings.